Granted Patent
Utility
US 6,081,978 · App. 09/452,458
Resin-encapsulated semiconductor device producing apparatus and method
Inventors:
Masaki Utsumi, Takahiro Matsuo, Hiroshi Hidaka
Patented Case
View Patent ↗
Granted: Jul 4, 2000
Filed: Dec 2, 1999
Inventors
Masaki Utsumi
Takahiro Matsuo
Hiroshi Hidaka
Assignee (at issue)
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.