Granted Patent
Utility
US 6,083,780 · App. 08/847,668
Semiconductor device and method of fabrication thereof
Inventor:
Hiroyasu Yasuda
Patented Case
View Patent ↗
Granted: Jul 4, 2000
Filed: Apr 22, 1997
Inventor
Hiroyasu Yasuda
Assignee (at issue)
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.