Granted Patent
Utility
US 6,083,813 · App. 09/061,044
Method for forming a compound semiconductor device using a buffer layer over a corrugated surface
Inventor:
Yasumasa Kashima
Patented Case
View Patent ↗
Granted: Jul 4, 2000
Filed: Apr 16, 1998
Inventor
Yasumasa Kashima
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.