Granted Patent
Utility
US 6,083,825 · App. 09/329,113
Method of forming unlanded via hole
Inventors:
Jy-Hwang Lin, Yueh-Feng Ho, Pei-Jen Wang
Patented Case
View Patent ↗
Granted: Jul 4, 2000
Filed: Jun 9, 1999
Inventors
Jy-Hwang Lin
Yueh-Feng Ho
Pei-Jen Wang
Assignee (at issue)
United Semiconductor Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.