Granted Patent
Utility
US 6,084,663 · App. 08/834,945
Method and an apparatus for inspection of a printed circuit board assembly
Inventor:
Toh Peng Seng
Patented Case
View Patent ↗
Granted: Jul 4, 2000
Filed: Apr 7, 1997
Inventor
Toh Peng Seng
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.