Granted Patent
Utility
US 6,086,641 · App. 08/802,291
Die bonder for a semiconductor producing apparatus
Inventor:
Toshiaki Shironouchi
Patented Case
View Patent ↗
Granted: Jul 11, 2000
Filed: Feb 18, 1997
Inventor
Toshiaki Shironouchi
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.