Granted Patent
Utility
US 6,090,484 · App. 08/848,955
Thermally conductive filled polymer composites for mounting electronic devices and method of application
Inventor:
Steven E. Bergerson
Patented Case
View Patent ↗
Granted: Jul 18, 2000
Filed: Apr 30, 1997
Inventor
Steven E. Bergerson
Assignee (at issue)
The Bergquist Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.