Granted Patent
Utility
US 6,091,141 · App. 09/222,226
Bump chip scale semiconductor package
Inventor:
Young Wook Heo
Patented Case
View Patent ↗
Granted: Jul 18, 2000
Filed: Dec 29, 1998
Inventor
Young Wook Heo
Assignees (at issue)
Anam Semiconductor
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.