IP Library Granted Patent US 6,093,591
Granted Patent Utility
US 6,093,591 · App. 09/056,209

Method of fabricating a semiconductor integrated circuit device

Inventor: Shigeki Sawada
Patented Case View Patent ↗
Granted: Jul 25, 2000 Filed: Apr 7, 1998
Inventor
Shigeki Sawada
Assignee (at issue)
Matsushita Electronics Corporation

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Quick Facts
Patent No.
US 6,093,591
App. No.
09/056,209
Filed
1998-04-07
Granted
2000-07-25
Kind
A