Granted Patent
Utility
US 6,093,637 · App. 08/946,786
Method of making a multi-layer interconnection structure
Inventors:
Koji Kishimoto, Yoshiaki Yamada
Patented Case
View Patent ↗
Granted: Jul 25, 2000
Filed: Oct 8, 1997
Inventors
Koji Kishimoto
Yoshiaki Yamada
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.