Granted Patent
Utility
US 6,095,900 · App. 09/276,983
Method for manufacturing a workpiece carrier backing pad and pressure plate for polishing semiconductor wafers
Inventors:
Clinton O. Fruitman, Thomas K. Crosby, James Allen Schlueter
Patented Case
View Patent ↗
Granted: Aug 1, 2000
Filed: Mar 26, 1999
Inventors
Clinton O. Fruitman
Thomas K. Crosby
James Allen Schlueter
Assignee (at issue)
SpeedFam-IPEC Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.