IP Library › Granted Patent US 6,096,155
Granted Patent Utility
US 6,096,155 · App. 08/943,274

Method of dicing wafer level integrated multiple optical elements

Inventors: Brian Harden, Alan D. Kathman, Michael R. Feldman
Patented Case View Patent ↗
Granted: Aug 1, 2000 Filed: Oct 3, 1997
Inventors
Brian Harden
Alan D. Kathman
Michael R. Feldman
Assignee (at issue)
DigitalOptics Corporation

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,096,155
App. No.
08/943,274
Filed
1997-10-03
Granted
2000-08-01
Kind
A