Granted Patent
Utility
US 6,096,433 · App. 09/027,180
Laminated substrate fabricated from semiconductor wafers bonded to each other without contact between insulating layer and semiconductor layer and process of fabrication thereof
Inventors:
Hiroaki Kikuchi, Tomohiro Hamajima
Patented Case
View Patent ↗
Granted: Aug 1, 2000
Filed: Feb 20, 1998
Inventors
Hiroaki Kikuchi
Tomohiro Hamajima
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.