Granted Patent
Utility
US 6,096,632 · App. 09/058,141
Fabrication method of semiconductor device using CMP process
Inventor:
John M. Drynan
Patented Case
View Patent ↗
Granted: Aug 1, 2000
Filed: Apr 10, 1998
Inventor
John M. Drynan
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.