Granted Patent
Utility
US 6,096,637 · App. 09/124,198
Electromigration-resistant via structure
Inventors:
Tirunelveli S. Sriram, Ann C. Westerheim, John J. Maziarz, Vladimir Bolkhovsky
Patented Case
View Patent ↗
Granted: Aug 1, 2000
Filed: Jul 28, 1998
Inventors
Tirunelveli S. Sriram
Ann C. Westerheim
John J. Maziarz
Vladimir Bolkhovsky
Assignee (at issue)
Compaq Computer Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.