Granted Patent
Utility
US 6,097,095 · App. 09/328,644
Advanced fabrication method of integrated circuits with borderless vias and low dielectric-constant inter-metal dielectrics
Inventor:
Henry Chung
Patented Case
View Patent ↗
Granted: Aug 1, 2000
Filed: Jun 9, 1999
Inventor
Henry Chung
Assignee (at issue)
AlliedSignal, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.