Granted Patent
Utility
US 6,100,167 · App. 09/082,905
Process for the removal of copper from polished boron doped silicon wafers
Inventors:
Robert J. Falster, Fabrizio Leoni, Marco Bricchetti, Alessandro Corradi
Patented Case
View Patent ↗
Granted: Aug 8, 2000
Filed: May 21, 1998
Inventors
Robert J. Falster
Fabrizio Leoni
Marco Bricchetti
Alessandro Corradi
Assignee (at issue)
MEMC Electronic Materials, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.