Granted Patent
Utility
US 6,100,183 · App. 09/132,384
Method for fabricating a via
Inventors:
William Lu, Tsung-Yuan Hung, Chi-Cheng Yang, Ching-Hsing Hsieh
Patented Case
View Patent ↗
Granted: Aug 8, 2000
Filed: Aug 11, 1998
Inventors
William Lu
Tsung-Yuan Hung
Chi-Cheng Yang
Ching-Hsing Hsieh
Assignee (at issue)
United Semiconductor Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.