Granted Patent
Utility
US 6,100,583 · App. 09/256,360
Semiconductor device containing semiconductor element in package
Inventor:
Makoto Ohmori
Patented Case
View Patent ↗
Granted: Aug 8, 2000
Filed: Feb 24, 1999
Inventor
Makoto Ohmori
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.