Granted Patent
Utility
US 6,100,593 · App. 09/032,362
Multiple chip hybrid package using bump technology
Inventors:
Allen S. Yu, Paul J. Steffan, Thomas C. Scholer
Patented Case
View Patent ↗
Granted: Aug 8, 2000
Filed: Feb 27, 1998
Inventors
Allen S. Yu
Paul J. Steffan
Thomas C. Scholer
Assignee (at issue)
Advanced Micro Devices, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.