Granted Patent
Utility
US 6,103,552 · App. 09/131,429
Wafer scale packaging scheme
Inventor:
Mou-Shiung Lin
Patented Case
View Patent ↗
Granted: Aug 15, 2000
Filed: Aug 10, 1998
Inventor
Mou-Shiung Lin
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.