Granted Patent
Utility
US 6,121,682 · App. 09/469,131
Multi-chip package
Inventor:
Jae Myun Kim
Patented Case
View Patent ↗
Granted: Sep 19, 2000
Filed: Dec 21, 1999
Inventor
Jae Myun Kim
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.