Granted Patent
Utility
US 6,124,149 · App. 09/184,514
Method of making stackable semiconductor chips to build a stacked chip module
Inventors:
Kyung Wook Paik, Jin Su Kim, Hyung Su Ko
Patented Case
View Patent ↗
Granted: Sep 26, 2000
Filed: Nov 2, 1998
Inventors
Kyung Wook Paik
Jin Su Kim
Hyung Su Ko
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.