Granted Patent
Utility
US 6,125,014 · App. 09/105,598
Via-less connection using interconnect traces between bond pads and a transducer coil of a magnetic head slider
Inventor:
Vernon M. Riedlin, Jr.
Patented Case
View Patent ↗
Granted: Sep 26, 2000
Filed: Jun 26, 1998
Inventor
Vernon M. Riedlin, Jr.
Assignee (at issue)
Read Rite Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.