Granted Patent
Utility
US 6,130,113 · App. 09/114,345
Enhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly process
Inventors:
Mohammad Eslamy, Larry Jacobsen
Patented Case
View Patent ↗
Granted: Oct 10, 2000
Filed: Jul 13, 1998
Inventors
Mohammad Eslamy
Larry Jacobsen
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.