Granted Patent
Utility
US 6,130,153 · App. 09/166,185
Interconnection fabrication method for semiconductor device
Inventor:
Jae-Hee Ha
Patented Case
View Patent ↗
Granted: Oct 10, 2000
Filed: Oct 5, 1998
Inventor
Jae-Hee Ha
Assignee (at issue)
LG Semicon Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.