IP Library › Granted Patent US 6,130,474
Granted Patent Utility
US 6,130,474 · App. 09/417,159

Leads under chip IC package

Inventor: David J. Corisis
Patented Case View Patent ↗
Granted: Oct 10, 2000 Filed: Oct 12, 1999
Inventor
David J. Corisis
Assignee (at issue)
Micron Technology, Inc.

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Quick Facts
Patent No.
US 6,130,474
App. No.
09/417,159
Filed
1999-10-12
Granted
2000-10-10
Kind
A