Granted Patent
Utility
US 6,130,821 · App. 09/204,818
Multi-chip assembly having a heat sink and method thereof
Inventor:
Mark A. Gerber
Patented Case
View Patent ↗
Granted: Oct 10, 2000
Filed: Dec 3, 1998
Inventor
Mark A. Gerber
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.