IP Library Granted Patent US 6,132,292
Granted Patent Utility
US 6,132,292 · App. 09/161,218

Chemical mechanical polishing method suitable for highly accurate planarization

Inventor: Akira Kubo
Patented Case View Patent ↗
Granted: Oct 17, 2000 Filed: Sep 28, 1998
Inventor
Akira Kubo
Assignee (at issue)
NEC CORPORATION

This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.

Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 6,132,292
App. No.
09/161,218
Filed
1998-09-28
Granted
2000-10-17
Kind
A