Granted Patent
Utility
US 6,132,294 · App. 09/161,793
Method of enhancing semiconductor wafer release
Inventor:
Chenting Lin
Patented Case
View Patent ↗
Granted: Oct 17, 2000
Filed: Sep 28, 1998
Inventor
Chenting Lin
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.