Granted Patent
Utility
US 6,132,586 · App. 09/096,220
Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly
Inventors:
John A. Adams, Gerald A. Krulik, Everett D. Smith
Patented Case
View Patent ↗
Granted: Oct 17, 2000
Filed: Jun 11, 1998
Inventors
John A. Adams
Gerald A. Krulik
Everett D. Smith
Assignee (at issue)
Integrated Process Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.