Granted Patent
Utility
US 6,133,595 · App. 09/056,506
Solid state imaging device with improved ground adhesion layer
Inventor:
Hiroyuki Senda
Patented Case
View Patent ↗
Granted: Oct 17, 2000
Filed: Apr 7, 1998
Inventor
Hiroyuki Senda
Assignee (at issue)
Matsushita Electronics Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.