Granted Patent
Utility
US 6,133,626 · App. 09/159,575
Three dimensional packaging configuration for multi-chip module assembly
Inventors:
Robert E. Hawke, Atin J. Patel, Sukhminder S. Binapal, Charles Divita, Lynn McNeil, Thomas Fletcher
Patented Case
View Patent ↗
Granted: Oct 17, 2000
Filed: Sep 24, 1998
Inventors
Robert E. Hawke
Atin J. Patel
Sukhminder S. Binapal
Charles Divita
Lynn McNeil
Thomas Fletcher
Assignee (at issue)
Gennum Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.