Granted Patent
Utility
US 6,135,863 · App. 09/295,127
Method of conditioning wafer polishing pads
Inventors:
David Zhang, Ralph V. Vogelgesang, Henry F. Erk
Patented Case
View Patent ↗
Granted: Oct 24, 2000
Filed: Apr 20, 1999
Inventors
David Zhang
Ralph V. Vogelgesang
Henry F. Erk
Assignee (at issue)
MEMC Electronic Materials, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.