IP Library › Granted Patent US 6,136,687
Granted Patent Utility
US 6,136,687 · App. 08/978,967

Method of forming air gaps for reducing interconnect capacitance

Inventors: Shih-Ked Lee, Chu-Tsao Yen, Cheng-Chen Calvin Hsueh, James R. Shih, Chuen-Der Lien
Patented Case View Patent ↗
Granted: Oct 24, 2000 Filed: Nov 26, 1997
Inventors
Shih-Ked Lee
Chu-Tsao Yen
Cheng-Chen Calvin Hsueh
James R. Shih
Chuen-Der Lien
Assignee (at issue)
Integrated Device Technology, Inc.

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Quick Facts
Patent No.
US 6,136,687
App. No.
08/978,967
Filed
1997-11-26
Granted
2000-10-24
Kind
A