Granted Patent
Utility
US 6,136,692 · App. 09/455,058
Method for forming metal plug electrode in semiconductor device
Inventor:
Koji Urabe
Patented Case
View Patent ↗
Granted: Oct 24, 2000
Filed: Dec 6, 1999
Inventor
Koji Urabe
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.