Granted Patent
Utility
US 6,136,694 · App. 09/223,330
Method for forming via hole
Inventor:
Yueh-Feng Ho
Patented Case
View Patent ↗
Granted: Oct 24, 2000
Filed: Dec 30, 1998
Inventor
Yueh-Feng Ho
Assignee (at issue)
United Semiconductor Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.