Granted Patent
Utility
US 6,136,714 · App. 09/213,469
Methods for enhancing the metal removal rate during the chemical-mechanical polishing process of a semiconductor
Inventor:
Ronald J. Schutz
Patented Case
View Patent ↗
Granted: Oct 24, 2000
Filed: Dec 17, 1998
Inventor
Ronald J. Schutz
Assignee (at issue)
Siemens Aktiengesellschaft
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.