Granted Patent
Utility
US 6,137,125 · App. 09/019,627
Two layer hermetic-like coating for on-wafer encapsulatuon of GaAs MMIC's having flip-chip bonding capabilities
Inventors:
Varmazis D. Costas, Anthony Kaleta
Patented Case
View Patent ↗
Granted: Oct 24, 2000
Filed: Feb 6, 1998
Inventors
Varmazis D. Costas
Anthony Kaleta
Assignee (at issue)
Whitaker & Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.