Granted Patent
Utility
US 6,140,225 · App. 09/104,714
Method of manufacturing semiconductor device having multilayer wiring
Inventors:
Tatsuya Usami, Hidemitsu Aoki, Yasuaki Tsuchiya, Shinya Yamasaki
Patented Case
View Patent ↗
Granted: Oct 31, 2000
Filed: Jun 25, 1998
Inventors
Tatsuya Usami
Hidemitsu Aoki
Yasuaki Tsuchiya
Shinya Yamasaki
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.