Granted Patent
Utility
US 6,140,700 · App. 08/966,703
Semiconductor chip package and method for fabricating the same
Inventor:
Myeong Jin Shin
Patented Case
View Patent ↗
Granted: Oct 31, 2000
Filed: Nov 10, 1997
Inventor
Myeong Jin Shin
Assignee (at issue)
LG Semicon Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.