Granted Patent
Utility
US 6,142,663 · App. 09/234,368
Temperature measuring method for semiconductor wafers and processing apparatus
Inventor:
Eiryo Takasuka
Patented Case
View Patent ↗
Granted: Nov 7, 2000
Filed: Jan 21, 1999
Inventor
Eiryo Takasuka
Assignee (at issue)
SUMITOMO METAL INDUSTRIES, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.