Granted Patent
Utility
US 6,143,583 · App. 09/093,492
Dissolved wafer fabrication process and associated microelectromechanical device having a support substrate with spacing mesas
Inventor:
Ken Maxwell Hays
Patented Case
View Patent ↗
Granted: Nov 7, 2000
Filed: Jun 8, 1998
Inventor
Ken Maxwell Hays
Assignee (at issue)
Honeywell Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.