Granted Patent
Utility
US 6,143,639 · App. 09/429,877
Methods of forming electrically conductive interconnections and electrically interconnected substrates
Inventors:
Curtis M. Medlen, Mark E. Tuttle
Patented Case
View Patent ↗
Granted: Nov 7, 2000
Filed: Oct 29, 1999
Inventors
Curtis M. Medlen
Mark E. Tuttle
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.