Granted Patent
Utility
US 6,146,517 · App. 09/315,091
Integrated circuits with copper metallization for interconnections
Inventor:
Mark Hoinkis
Patented Case
View Patent ↗
Granted: Nov 14, 2000
Filed: May 19, 1999
Inventor
Mark Hoinkis
Assignee (at issue)
Infineon Technologies North America Corp.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.