Granted Patent
Utility
US 6,146,989 · App. 08/975,046
Method of fabricating semiconductor device with cavity interposed between wirings
Inventor:
Norio Okada
Patented Case
View Patent ↗
Granted: Nov 14, 2000
Filed: Nov 20, 1997
Inventor
Norio Okada
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.