Granted Patent
Utility
US 6,150,713 · App. 09/260,471
Lead frame for semiconductor package and lead frame plating method
Inventors:
Se-chul Park, Kyu Han Lee, Ju Bong KIM, Sung-il Kang, Dong Il Shin, Bae-soon Jang
Patented Case
View Patent ↗
Granted: Nov 21, 2000
Filed: Mar 2, 1999
Inventors
Se-chul Park
Kyu Han Lee
Ju Bong KIM
Sung-il Kang
Dong Il Shin
Bae-soon Jang
Assignee (at issue)
Samsung Aerospace Industries, Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.