Granted Patent
Utility
US 6,159,840 · App. 09/439,930
Fabrication method for a dual damascene comprising an air-gap
Inventor:
Jyh-Ming Wang
Patented Case
View Patent ↗
Granted: Dec 12, 2000
Filed: Nov 12, 1999
Inventor
Jyh-Ming Wang
Assignees (at issue)
United Semiconductor Corp.
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.