Granted Patent
Utility
US 6,162,664 · App. 09/168,886
Method for fabricating a surface mounting type semiconductor chip package
Inventor:
Jin-Sung Kim
Patented Case
View Patent ↗
Granted: Dec 19, 2000
Filed: Oct 9, 1998
Inventor
Jin-Sung Kim
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.