Granted Patent
Utility
US 6,162,702 · App. 09/334,835
Self-supported ultra thin silicon wafer process
Inventors:
William R. Morcom, Stephen Carl Ahrens, Jeffrey P. Spindler, Raymond Ford, Jeffrey Edward Lauffer
Patented Case
View Patent ↗
Granted: Dec 19, 2000
Filed: Jun 17, 1999
Inventors
William R. Morcom
Stephen Carl Ahrens
Jeffrey P. Spindler
Raymond Ford
Jeffrey Edward Lauffer
Assignee (at issue)
Intersil Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.